Samsung and Broadcom signed a $200 billion memorandum of understanding in late July 2026, part of three mega-deals reshaping the global chip industry within days.1 Nvidia and SK Hynix struck a $500 billion memory supply agreement the same stretch.2 A South Korea-US AI summit added a roughly $950 billion package tied to chip and AI infrastructure investment.1
Together the three deals put nearly trillions of hyperscale and sovereign capital into AI chip and memory supply chains worldwide, ahead of the compute buildout those chips are meant to power.
Chip design tools are absorbing the same push, spanning firms across the US and Europe. Cadence, Synopsys and Siemens are embedding Nvidia's agentic AI into their electronic design automation workflows, aiming to speed the engineering cycle behind next-generation processors and memory.3
RF and analog chipmaking is consolidating in parallel. Skyworks and Qorvo announced their merger's leadership team as the companies combine engineering and customer operations across global markets.4 "Today's announcement reflects the strong partnership that has shaped our integration planning efforts from the very beginning," said Bob Bruggeworth.4
Traditional semiconductor suppliers are posting record results worldwide as the AI buildout widens beyond the largest chipmakers. Amkor and Allegro are among those reporting record performance.5
Global investor appetite reflects the same trend. The iShares Semiconductor ETF (SOXX) was up about 79% year to date and roughly 152% over one year as of June 5, 2026.6 Vicor Corporation, a power semiconductor supplier, reported trailing twelve-month revenue of $471.7 million and net income of $136.7 million, with an $11.3 billion market capitalization as of the July 6, 2026 market close.7
Together, the deals show a semiconductor supply chain being rebuilt around AI infrastructure demand, spanning memory, design tools, RF components and packaging across the US, South Korea and beyond.
